Welcome to the 38th Annual GOMACTech Conference
MARCH 31-APRIL 3, 2014 - Las Vegas, NV

http://www.sheridanprinting.com/pcm/gomactech/gomactech.cfm

Title: Orthogonal Scaling to Extend Computing into the Cognitive Era

Abstract:
As conventional device scaling slows to a grinding halt driven primarily by increased development and manufacturing costs with saturating returns, computing is experiencing a paradigm shift characterized by highly associative and contextual environments, approximate or probabilistic computations and very adaptive or dynamic structures. Such machines will likely be hybrids of both von Neuman machines as well as those with a morecognitive architecture. In this new era of hugely parallel and highly connected simple cores, the role of packaging and non-traditional silicon processing such as 3-Dimensional integration, including heterogeneous integration will be paramount. We will examine in detail the challenges ahead in the areas of packaging and
3-Dimensional integration and suggest a global roadmap as we enter this new era of computing. Specifically, we will address the issue of scaling the package and the board as means to improve the cost-power-performance tradeoffs and argue that significant gains can be achieved through novel system integration constructs in spite of the saturation of "classical" silicon scaling.